2FHC06M33XX
• Applicable for paralleling up to 4 power modules
• Supports up to 3300V SiC-module
• Digital control method
• Propogation-delay of paralleling gate signal ≤ 5ns
• Isolated NTC sampling
• Short-circuit protection (soft shut down)
• Miller clamp
• Intelligent fault management
Product Max Breakdown Voltage Numbers of channels Comformal coated Driving Mode Gate Peak Current(Max) Gate Turn-off Voltage Interface Type Protection Features Logic Input Voltage Max Switching Frequecy Gate Turn-on Voltage Supported Module Type Supported Topologies Power-Ouput/Channels(Max) Paralleling Supported Supply Voltage(Typ)
2FHC06M33XX 3300V 2 Optional Direct/Half-bridge / -10V~-2V Electrical Soft shut down Undervoltage Miller clamp Isolate NTC sampling Intelligent fault management 15V 100kHz 15~20V SiC 2-level 6W 1~4 15V or 24V

Product Information

Product Details

The 2FHC06M33XX gate driver core is designed for 3300V Linpak/XHP-2/LV100 SiC MOSFET with 15~20V positive gate voltage and -2~-10V negative gate voltage in on-state.

The 2FHC06M33XX features dual-channel with electrical interfaces, and supports 2-level topologies.

The 2FHC06M33XX is a high-performance, dual-channel SiC/IGBT gate driver core developed based on Firstack intelligent chip technology, and can flexibly match 1~4 SiC/IGBT modules. The overall architecture consists of a MCC (main control core) and multiple MAB (module adaptor board) units, the MCC and MAB are connected by a set of cables.

 

Compact and Highly Integrated

Gate driver core for Linpak/XHP-2/LV100 SiC MOSFET

Dual-channel gate driver core

15~20V positive gate voltage

-2~-10V negative gate voltage

6W output power per channel at maximum ambient temperature

Electrical interface

-40°C to 85°C operating ambient temperature

Isolate NTC sampling

 

Protection

Short-circuit protection (soft shut down)

Undervoltage protection

Miller clamp

Intelligent fault management

Data Sheet